EP3CLS70F484C7N vs EP3CLS70F484C8N Comparison

Detailed side-by-side comparison of EP3CLS70F484C7N by Intel and EP3CLS70F484C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F484C7N EP3CLS70F484C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $96.30 $56.80
Device Family Cycloneยฎ III LS โ€”
Logic Elements (LE) 70,208 โ€”
Logic Array Blocks (LABs) 4,388 4,388
Embedded Memory Bits 3,068,928 3,068,928 bits (approx. 2,997 Kbit)
Maximum User I/Os 278 278
Maximum Operating Frequency 437.5 MHz โ€”
Process Technology TSMC 65nm low-power (LP) 65 nm TSMC low-power
Core Supply Voltage (VCCINT) 1.2 V โ€”
Package Type 484-ball FineLine BGA (FBGA-484) โ€”
Package Dimensions 19 x 19 mm, 1.0 mm ball pitch โ€”
Mounting Type Surface Mount โ€”
Operating Temperature [DATA_NEEDED: commercial/industrial grade] Commercial 0C to +85C (C8 grade)
MSL Level [DATA_NEEDED: MSL rating] โ€”
RoHS Status Compliant (per Intel product page) Compliant
Configuration Method JTAG / Passive Serial / Active Serial โ€”
Design Tool Intel Quartus II (Cyclone III support) โ€”
Family โ€” Cyclone III LS
Device Logic Elements (LEs) โ€” 70,208
DSP Blocks (18x18 Multipliers) โ€” 247
Phase-Locked Loops (PLLs) โ€” 4
Global Clock Networks โ€” 20
Core Supply Voltage โ€” 1.2 V
Package โ€” 484-ball FBGA (FineLine BGA), 23x23 mm
Speed Grade โ€” 8 (slowest commercial)
Configuration Modes โ€” Passive Serial (PS), Fast Passive Parallel (FPP), JTAG
Bitstream Encryption โ€” AES-256 (LS family feature)

Datasheets & Resources

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