EP3SE110F1152C3N vs EP3SE110F1152C4L Comparison

Detailed side-by-side comparison of EP3SE110F1152C3N by Intel and EP3SE110F1152C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F1152C3N EP3SE110F1152C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy NRND
Stock Status In Stock In Stock
Unit Price (USD) $1,560.00 $3,372.13
Family Stratix III E —
Series Stratix III Stratix III E
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) 4,300 —
Total RAM Bits 8,936,448 —
User I/Os 744 —
Operating Frequency (max) 500 MHz —
Core Supply Voltage 1.1 V nominal 0.9 V
I/O Supply Voltage [DATA_NEEDED: I/O supply range] —
Process Technology 65 nm TSMC —
Package Type FC-FBGA-1152 (flip-chip BGA) FBGA (Fine-pitch BGA)
Operating Temperature 0 °C to 85 °C (commercial) 0C to 85C (commercial)
Speed Grade C3 C4 (speed grade 4)
Mounting Type Surface Mount Surface Mount
Mounting Style SMD/SMT (Tray) —
DSP Blocks Yes (embedded multipliers) —
Memory Type M9K and M144K block RAM —
External Memory Support DDR/DDR2/DDR3 with read/write leveling —
Boundary Scan IEEE 1149.1 (JTAG) —
RoHS [DATA_NEEDED: RoHS status] —
Lead-Free Yes (per Altera/Intel datasheet family convention) —
Device Type — FPGA - Field Programmable Gate Array
Logic Elements — 107500
Embedded Memory — 8936448 bits (8.9 Mbit)
Maximum User I/O — 744
Internal Frequency — 800 MHz (max)
Package — 1152-ball FCBGA (BBGA-1152)
Pins — 1152
RoHS Status — [DATA_NEEDED: RoHS status]
Manufacturer — Intel (formerly Altera)

Datasheets & Resources

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