EP3SE110F1152C3N vs EP3SE110F1152I3N Comparison

Detailed side-by-side comparison of EP3SE110F1152C3N by Intel and EP3SE110F1152I3N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F1152C3N EP3SE110F1152I3N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family Stratix III E Stratix III E FPGA
Series Stratix III Stratix III E
Logic Elements (LE) 107,500 107,500
Logic Array Blocks (LABs) 4,300 4300
Total RAM Bits 8,936,448 8,936,448
User I/Os 744 —
Operating Frequency (max) 500 MHz —
Core Supply Voltage 1.1 V nominal —
I/O Supply Voltage [DATA_NEEDED: I/O supply range] —
Process Technology 65 nm TSMC 65 nm CMOS
Package Type FC-FBGA-1152 (flip-chip BGA) —
Operating Temperature 0 °C to 85 °C (commercial) —
Speed Grade C3 -3 (I3 fast grade, industrial)
Mounting Type Surface Mount Surface Mount
Mounting Style SMD/SMT (Tray) —
DSP Blocks Yes (embedded multipliers) —
Memory Type M9K and M144K block RAM —
External Memory Support DDR/DDR2/DDR3 with read/write leveling —
Boundary Scan IEEE 1149.1 (JTAG) —
RoHS [DATA_NEEDED: RoHS status] —
Lead-Free Yes (per Altera/Intel datasheet family convention) —
Manufacturer — Altera (now Intel PSG)
Maximum User I/Os — 744
Number of I/O Banks — Modular I/O banks (see Stratix III Device Handbook)
Core Voltage — 1.1 V
Operating Temperature Range — -40C to +100C (industrial, I3 grade)
Package — 1152-ball FC-FBGA (Flip-Chip Fine-pitch BGA)
Lead-Free / RoHS — Lead-free (N suffix); RoHS compliance status: see Stratix III Device Handbook
Configuration — JTAG via Quartus II; supports AS, PS, JTAG, FPP modes
Internal Supply Voltage (Max) — 0.94 V (per Partstack listing)

Datasheets & Resources

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