EP3SE110F1152C4N vs EP3SE110F1152I3 Comparison

Detailed side-by-side comparison of EP3SE110F1152C4N by Intel and EP3SE110F1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F1152C4N EP3SE110F1152I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family Stratix III Enhanced (E) —
Logic Elements 107,500 —
Memory Bits 8,936,448 —
Embedded Multipliers (18x18) 896 —
Logic Array Blocks (LABs) 4300 —
User I/O Pins 744 —
Core Voltage 1.1 V —
Process Technology 65 nm 65 nm CMOS (1.1 V, all-layer copper SRAM)
Maximum Operating Frequency 450 MHz —
Package 1152-ball FCBGA (Flip-Chip BGA) —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0C to +85C (Commercial) -40C to +100C (Industrial, I3 grade)
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / AES-256 —
RoHS Status Compliant Non-Compliant per DigiKey product page
MSL Level 3 (168 hours) —
Design Software Quartus II (v9.1 or later) —
Series — Stratix III E
Manufacturer — Intel (formerly Altera)
Logic Elements (LEs) — 107,500
Total Memory Bits — 8,936,448
LABs/CLBs — 4,300
Number of I/O — 744
Number of Logic Elements/Cells — 107,500
Total RAM Bits — 8,936,448
Core Operating Frequency — 500 MHz
Supply Voltage — 1.1 V
Package Type — 1152-BBGA, FCBGA (FC-FBGA)

Datasheets & Resources

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