EP3SL340F1760I3 vs EP3SL340F1760I4L Comparison

Detailed side-by-side comparison of EP3SL340F1760I3 by Intel and EP3SL340F1760I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL340F1760I3 EP3SL340F1760I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Series Stratix III L —
Logic Elements 337,500 LE 337,500
LABs (Logic Array Blocks) 13,500 —
Embedded Memory Bits 18,822,144 bit —
User I/Os 1120 —
Number of Pins / Balls 1760 —
Package Type FC-FBGA (1760-ball, FineLine BGA) —
Package Code BGA1760, 42x42, 40 —
Core Voltage 1.1 V 0.9 V
Process Technology 65 nm TSMC 65 nm
Operating Temperature -40 °C to 100 °C (Industrial grade, I3 suffix) -40C to +100C (Industrial)
Speed Grade I3 (Industrial, mid-speed bin) I4
Mounting Type Surface Mount —
RoHS Status Compliant (Pb-free BGA balls) Compliant
Configuration Memory SRAM-based, volatile (requires external configuration device) —
Transceivers [DATA_NEEDED: transceiver count and data rate for this F1760 variant] Up to 24 (up to 6.375 Gbps)
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] 384 (18x18 multipliers)
PLLs [DATA_NEEDED: PLL count] —
MSL Level MSL3 (JEDEC J-STD-020, reflow 245 °C peak) 4
Family — Stratix III L
Adaptive Logic Modules (ALMs) — 135,000
Embedded Memory (bits) — 18,821,144
Memory Blocks — M9K + M144K
Maximum User I/O — 1,120
Package — 1760-ball FCBGA (F1760)
Static Power — Stratix III L variant (approx. 50% lower than standard Stratix III)

Datasheets & Resources

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