EP3SL50F780C2N vs EP3SE50F780I3 Comparison
Detailed side-by-side comparison of EP3SL50F780C2N by Intel and EP3SE50F780I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL50F780C2N | EP3SE50F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Last Time Buy |
| Series | Stratix III L | — |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 47,500 | 47,500 |
| Configurable Logic Blocks (LABs) | 1,900 | — |
| Embedded Memory | 2,184,192 bits | — |
| User I/Os | 488 | — |
| Package | 780-ball FBGA (FCBGA) | 780-ball FC-FBGA (FineLine BGA) |
| Internal Fabric Frequency (max) | 800 MHz | — |
| Process Technology | 65 nm | 65 nm |
| Core Supply Voltage | 0.9 V | — |
| Speed Grade | C2 | — |
| Operating Temperature | 0 °C to 85 °C (Commercial) | — |
| Mounting Type | Surface Mount | — |
| RoHS Status | Compliant | Compliant |
| Lifecycle Status | Not Recommended for New Designs (NRND) | — |
| Family | — | Stratix III Enhanced (E) |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 5,760,000 |
| User I/O Count | — | 488 |
| Internal Frequency (max) | — | 800 MHz |
| Operating Temperature Range | — | -40 C to +100 C (industrial, 'I' grade) |
| Supply Voltage (Core) | — | 0.86 V to 1.13 V (typical 1.1 V) |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | Up to 8 (fractional-N) |
| DSP Multiplier Blocks | — | Yes (per-ALM DSP blocks) |
| Adaptive Logic Modules (ALMs) | — | Yes |
| MSL Level | — | 3 (168 hours) |
| Lead-Free | — | Yes |