EP4CE10E22I7N vs EP4CE10E22C8L Comparison
Detailed side-by-side comparison of EP4CE10E22I7N by Altera and EP4CE10E22C8L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE10E22I7N | EP4CE10E22C8L |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Cyclone IV E Field Programmable Gate Array (FPGA) | Cyclone IV E field-programmable gate array (FPGA) |
| Logic Elements | 10,320 cells | 10,320 cells |
| Embedded Memory | 423,936 bits | 423,936 bits |
| Core Supply Voltage | 1.2 V | 1.2 V nominal |
| User I/O Count | 91 I/O | — |
| Package | 144-pin LQFP exposed-pad package | 144-LQFP Exposed Pad |
| Mounting Type | Surface mount | Surface mount |
| Package and Device Combination | EP4CE10 E22 | — |
| FPGA Device Family | Cyclone IV E | — |
| Logic Cell Architecture | [DATA_NEEDED: FPGA logic architecture] | — |
| Maximum Clock Frequency | [DATA_NEEDED: maximum clock frequency] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Number of PLL Blocks | [DATA_NEEDED: PLL block count] | — |
| Number of Memory Blocks | [DATA_NEEDED: memory block count] | — |
| Embedded Memory Block Size | [DATA_NEEDED: embedded memory block size] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Exposed Pad Thermal Connection | Thermal pad exposed in package | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | Compliant |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| User I/O | — | 91 I/O |
| Technology | — | 60 nm |
| Package Code | — | HLFQFP |
| Package Shape | — | Square |
| Terminal Count | — | 144 terminals |
| Terminal Form | — | Gull wing |
| Series | — | Cyclone IV E |
| Manufacturer | — | Intel / Altera |
| Catalog Description | — | FPGA with 91 I/O, 10,320 cells, 423,936 embedded-memory bits, and 144-LQFP exposed-pad package |
| Product Lifecycle Status | — | Active |
| REACH Status | — | Compliant |