EP4CE10E22I7N vs EP4CE6E22I7 Comparison
Detailed side-by-side comparison of EP4CE10E22I7N by Altera and EP4CE6E22I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE10E22I7N | EP4CE6E22I7 |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Cyclone IV E Field Programmable Gate Array (FPGA) | — |
| Logic Elements | 10,320 cells | — |
| Embedded Memory | 423,936 bits | 270 Kbits (M9K blocks) |
| Core Supply Voltage | 1.2 V | — |
| User I/O Count | 91 I/O | — |
| Package | 144-pin LQFP exposed-pad package | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Mounting Type | Surface mount | Surface Mount |
| Package and Device Combination | EP4CE10 E22 | — |
| FPGA Device Family | Cyclone IV E | — |
| Logic Cell Architecture | [DATA_NEEDED: FPGA logic architecture] | — |
| Maximum Clock Frequency | [DATA_NEEDED: maximum clock frequency] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Number of PLL Blocks | [DATA_NEEDED: PLL block count] | — |
| Number of Memory Blocks | [DATA_NEEDED: memory block count] | — |
| Embedded Memory Block Size | [DATA_NEEDED: embedded memory block size] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Exposed Pad Thermal Connection | Thermal pad exposed in package | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance status] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | — |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 6,272 |
| Embedded Multipliers (18 x 18) | — | 15 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 |
| Maximum User I/O Pins | — | 91 |
| Process Technology | — | 60 nm (low-power) |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | — | Dynamic OCT supported |
| Configuration Methods | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |
| MSL Level | — | 3 (168 hours) |
| RoHS Status | — | Compliant |