EP4CE15E22C9L vs EP4CE15E22C8N Comparison

Detailed side-by-side comparison of EP4CE15E22C9L by Intel and EP4CE15E22C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE15E22C9L EP4CE15E22C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Active
Device Type Cyclone IV E Field Programmable Gate Array (FPGA) —
Logic Elements 15,408 cells —
Embedded Memory 516,096 bits —
I/O Count 81 pins —
Process Technology 60 nm 60 nm low-power CMOS
Core Supply Voltage 1.2 V —
Total Package Pins 144 pins —
Package 144-LQFP Exposed Pad 144-pin EQFP (Enhanced QFP) with Exposed Pad
Package Code HLFQFP —
Terminal Form Gull wing —
Package Shape Square —
Mounting Style Surface mount —
Temperature Grade Other —
Programmable Device Type FPGA —
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Supply Current [DATA_NEEDED: core supply current] —
Memory Block Configuration [DATA_NEEDED: memory block configuration] —
Configuration Method [DATA_NEEDED: configuration method] SRAM-based, AS / PS / JTAG
Series — Cyclone IV E
Logic Elements (LEs) — 15,408
Embedded Memory (Bits) — 516,096
Embedded Memory (Kbits) — 504
Embedded 18x18 Multipliers — 56
General Purpose PLLs — 4
User I/O Pins — 81
Core Voltage — 1.2 V
Operating Temperature — 0C to +85C (Commercial)
Speed Grade — 8
Mounting Type — Surface Mount
MSL Level — 3
RoHS Status — Compliant

Datasheets & Resources

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