EP4CE15F17C6N vs EP4CE22F17I7N Comparison

Detailed side-by-side comparison of EP4CE15F17C6N by Intel and EP4CE22F17I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE15F17C6N EP4CE22F17I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type FPGA (Field Programmable Gate Array) —
Device Family Cyclone IV E —
Logic Elements 15,408 —
Configurable Logic Blocks (CLBs) 963 —
User I/O Pins 165 —
Embedded Memory 516,096 bits 608,256 bits (594 Kbits)
Maximum Frequency 472.5 MHz —
Core Supply Voltage 1.2 V —
Package Type 256-LBGA (FBGA-256) —
Package Size 17 x 17 mm —
Ball Pitch 1.0 mm —
Number of Balls 256 —
Mounting Type Surface Mount Surface Mount
Lead-Free Status Lead Free —
Process Technology [DATA_NEEDED: process technology] 60 nm low-power CMOS
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Number of M9K Memory Blocks [DATA_NEEDED: number of M9K memory blocks] —
Number of DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Number of PLLs [DATA_NEEDED: number of PLLs] —
Series — Cyclone IV E
Logic Elements (LE) — 22,320
Embedded Memory Blocks — 66 M9K blocks
Embedded 18x18 Multipliers — 66
Maximum User I/O Pins — 153
General-Purpose PLLs — 4
Global Clock Networks — 20
Core Voltage (VCCINT) — 1.2 V (typical); 1.0 V operation supported
Operating Temperature Grade — Industrial (-40C to +100C), I7 grade
Package — 256-ball FBGA (F17)
Configuration Mode — JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP)
RoHS Status — Compliant
Lead-Free — Yes
MSL Level — 3 (per JEDEC J-STD-020)

Datasheets & Resources

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