EP4CE55F23I7N vs EP4CE55F23I8L Comparison

Detailed side-by-side comparison of EP4CE55F23I7N by Intel and EP4CE55F23I8L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE55F23I7N EP4CE55F23I8L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone IV E —
Logic Elements 55,856 —
Configurable Logic Blocks (CLBs) 3,491 —
Embedded Memory 2,396,160 bits —
Embedded 18x18 Multipliers 56 156
PLLs 4 —
Maximum User I/O 324 —
Package 484-ball FBGA (23x23 mm, 1.0 mm pitch) 484-ball FBGA (23 x 23 mm, 1.0 mm pitch)
Process Technology TSMC 60 nm low-power 60 nm
Core Voltage 1.2 V —
Operating Temperature -40C to +100C (industrial, I7 grade) —
Mounting Type Surface Mount (BGA) —
Lead-Free / RoHS Yes (lead-free finish) —
Configuration Modes JTAG, AS, PS, FPP AS, PS, JTAG
Memory Interface Support DDR, DDR2, QDRII —
Device Family — Cyclone IV E
Logic Elements (LEs) — 55,856
Embedded Memory Bits — 2,396,160 bits (~234 Kbit / ~292.5 KByte)
Maximum User I/O Pins — 324
General-Purpose PLLs — 4
Core Supply Voltage — 1.2 V
Operating Temperature Range — -40C to +100C (Industrial)
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X
Speed Grade — 8
RoHS Status — Compliant
Lead-Free / Halogen-Free — Yes / Yes

Datasheets & Resources

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