EP4CE6E22C6N vs EP4CE6E22I7N Comparison
Detailed side-by-side comparison of EP4CE6E22C6N by Intel and EP4CE6E22I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE6E22C6N | EP4CE6E22I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | Cyclone IV E |
| Device | EP4CE6 | — |
| Logic Elements (LEs) | 6,272 | 6,272 |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Embedded Memory (Bits) | 270 Kbits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 2 | — |
| Global Clock Networks | 10 | Up to 20 |
| Maximum User I/Os | 91 | — |
| I/O Banks | 4 | — |
| Process Technology | 60 nm | 60 nm (TSMC low-power) |
| Core Voltage (VCCINT) | 1.2 V | 1.0 V to 1.2 V (nominal 1.2 V) |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) | — |
| Package | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40 C to +85 C (industrial, C6 speed grade) | — |
| RoHS Status | Lead-Free / Compliant | Compliant |
| Lead-Free | Yes | — |
| Configurable Logic Blocks (CLBs) | — | 392 |
| Embedded Memory (RAM) | — | 270 Kbits |
| User Flash Memory | — | 4 Kbits |
| User I/O Pins | — | 91 |
| PLLs (General-Purpose) | — | 2 |
| Operating Temperature (I7 grade) | — | -40C to +100C (junction) |
| Maximum Operating Frequency | — | Up to 472.5 MHz |
| Configuration Method | — | Serial (EPCS) or JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| MSL Level | — | 3 (per JEDEC J-STD-020) |