EP4CE6E22I7N vs EP4CE6E22C6N Comparison
Detailed side-by-side comparison of EP4CE6E22I7N by Intel and EP4CE6E22C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE6E22I7N | EP4CE6E22C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | 6,272 |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | 10 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | 1.2 V |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Package | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| RoHS Status | Compliant | Lead-Free / Compliant |
| Device | — | EP4CE6 |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| Embedded Memory (Bits) | — | 270 Kbits |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| I/O Banks | — | 4 |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Modes | — | JTAG, AS (Active Serial), PS (Passive Serial) |
| Operating Temperature | — | -40 C to +85 C (industrial, C6 speed grade) |
| Lead-Free | — | Yes |