EP4CGX50CF23I7N vs EP4CGX50CF23C7 Comparison
Detailed side-by-side comparison of EP4CGX50CF23I7N by Intel and EP4CGX50CF23C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX50CF23I7N | EP4CGX50CF23C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Family | Cyclone IV GX | — |
| Logic Elements (LE) | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Embedded Memory Bits | 2,562,048 | 2,562,048 bits |
| Maximum User I/O | 290 | 290 |
| Transceivers | 8 channels, up to 3.125 Gbps | Integrated (Cyclone IV GX) |
| Core Supply Voltage | 1.2 V | — |
| Package | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (F23) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (FBGA) |
| Operating Temperature | -40C to +100C (industrial, I7) | — |
| Configuration Modes | AS, PS, JTAG | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Process Node | 60 nm (Cyclone IV family) | — |
| RoHS Status | Compliant (lead-free N suffix) | Compliant |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 49,888 |
| Logic Cells | — | 49,888 |
| Embedded Memory Blocks | — | M9K blocks, 9 Kbit each |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm |
| Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | C7 |
| DSP Blocks | — | 18x18 hardware multipliers |