EP4SGX360HF35I3 vs EP4SGX360HF35C2N Comparison

Detailed side-by-side comparison of EP4SGX360HF35I3 by Intel and EP4SGX360HF35C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4SGX360HF35I3 EP4SGX360HF35C2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Manufacturer Intel (formerly Altera) —
Series Stratix IV GX Stratix IV GX
Family Stratix IV GX Field Programmable Gate Array FPGA - Field Programmable Gate Array
Logic Elements (LEs) 353,600 —
Total LABs 14,144 —
Embedded Memory (bits) 23,105,536 —
User I/Os 564 —
Core Voltage 0.9 V 0.9 V
Operating Temperature -40 °C to +100 °C (Industrial) 0C to +85C (commercial)
Package Type 1152-Ball FCBGA (FineLine BGA) —
Speed Grade F35 35 (HF35)
Process Technology 40 nm 40 nm CMOS
I/O Standards Supported LVDS, LVTTL, LVPECL, HSTL, SSTL —
Embedded Transceivers Yes (multi-gigabit) Yes (multi-gigabit)
DSP Blocks Yes (hard DSP blocks) Yes (variable-precision)
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Configuration Modes Serial, Parallel, JTAG, Active Serial —
Mounting Type Surface Mount (BGA) Surface Mount
Number of Logic Elements/Cells — 353,600
Number of LABs/CLBs — 14,144
Number of I/O — 564
Total RAM Bits — 23,105,536
DSP Performance — 800 MHz
Package — 1152-BBGA, FCBGA (HF35)
Lead Free — Yes
Power/Temperature Grade — C2

Datasheets & Resources

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