EPF10K100BFC256-3 vs EPF10K100AFC484-2N Comparison

Detailed side-by-side comparison of EPF10K100BFC256-3 by Intel and EPF10K100AFC484-2N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100BFC256-3 EPF10K100AFC484-2N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 10KE FLEX 10KA (FLEX-10KA)
Typical Gates 100,000 —
Logic Elements (LEs) 4,992 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 24,576 24576 (from 12 EABs)
Maximum Operating Frequency 200 MHz —
Process Technology 0.22 µm CMOS SRAM 0.30 µm CMOS
Core Supply Voltage 2.5 V (range 2.3 V to 2.7 V) —
Speed Grade -3 -2 (mid performance)
Package 256-pin FineLine BGA (FBGA) 484-FBGA (23 x 23 mm, 1.0 mm pitch)
User I/O Pins (max) [DATA_NEEDED: exact user I/O count for BFC256 package] —
Operating Temperature Range 0 °C to 70 °C —
Configuration Method SRAM, requires external config device —
JTAG Boundary Scan IEEE Std. 1149.1-1990 compliant —
PCI Compliance PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) PCI 33 MHz compliant I/O available
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL rating] —
RoHS Status [DATA_NEEDED: RoHS status] —
Series — FLEX 10KA
Logic Cells / Elements — 4992
Equivalent Gate Count — 100000
Number of Logic Array Blocks (LABs) — 624
Number of Embedded Array Blocks (EABs) — 12
User I/O Pins — 369
Supply Voltage (VCCINT/VCCIO) — 3.0 V to 3.6 V
Propagation Delay — 0.6 ns
Operating Temperature — 0 °C to +70 °C (Commercial)
Internal Memory Type — EAB (RAM/ROM block)
JTAG Support — IEEE 1149.1 boundary scan
Lead Free / RoHS — Refer to distributor data - FLEX 10KA generation often non-RoHS
Programming Toolchain — MAX+PLUS II / Quartus legacy support

Datasheets & Resources

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