EPF10K100EBC356-1 vs EPF10K100EBC356-3 Comparison

Detailed side-by-side comparison of EPF10K100EBC356-1 by Intel and EPF10K100EBC356-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-1 EPF10K100EBC356-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 10KE FLEX-10KE
System Gates 100,000 —
Logic Elements 4,992 —
Embedded Memory 49,152 bits —
User I/Os 274 274
Package 356-LBGA 356-LBGA (35 x 35 mm)
Process Technology 0.22 µm CMOS 0.22 micron CMOS
Core Voltage 2.5 V —
I/O Voltage 2.5 V / 3.3 V —
Internal Frequency 333.33 MHz —
Propagation Delay 0.6 ns —
Operating Temperature 0 °C to 70 °C 0 C to 70 C (Commercial)
JTAG (IEEE 1149.1) Yes —
Mounting Type Surface Mount Surface Mount
Logic Family CMOS —
RoHS Status Unknown - pre-RoHS design [DATA_NEEDED: RoHS compliance status]
MSL Level [DATA_NEEDED: MSL level] —
Logic Elements / Cells — 4,992
Total Gates — ~100,000
Logic Array Blocks (LABs) — 624
Embedded Memory (RAM bits) — 49,152
Supply Voltage (Core) — 2.5 V (2.375 V to 2.625 V)
Speed Grade — -3
Propagation Delay (typical) — 0.6 ns
Maximum Internal Frequency — 200 MHz
Configuration Technology — SRAM (volatile)

Datasheets & Resources

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