EPF10K100EBC356-1X vs EPF10K100EBC356-2X Comparison

Detailed side-by-side comparison of EPF10K100EBC356-1X by Intel and EPF10K100EBC356-2X by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-1X EPF10K100EBC356-2X
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND NRND
Series FLEX 10KE FLEX 10KE
Logic Elements 4,992 —
Typical Gates 100,000 —
Logic Array Blocks (LABs) 624 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 49,152 49152
User I/O Count 274 —
Propagation Delay 0.6 ns —
Logic Family CMOS CMOS
Core Process Technology 0.22 um CMOS, 5 metal layers —
Core Supply Voltage 2.5 V (2.375 V to 2.625 V) —
I/O Supply Voltage 3.3 V (multi-volt tolerant to 5 V) 3.3 V
Operating Temperature 0 C to +70 C (Commercial) 0 °C to +70 °C (Commercial)
Package Type 356-LBGA (BGA-356) —
Package Dimensions 35 x 35 mm, 1.27 mm ball pitch —
Speed Grade -1X —
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Method Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) —
RoHS Status [DATA_NEEDED: RoHS status] Lead free / RoHS Compliant
MSL Level [DATA_NEEDED: MSL rating] —
Manufacturer — Altera (Intel Programmable Solutions Group)
Number of Logic Elements/Cells — 4992
Number of Logic Array Blocks (LABs) — 624
Number of Gates — 100000
Number of User I/Os — 274
Number of Embedded Array Blocks (EABs) — 12
Core Voltage - Supply — 2.375 V to 2.625 V
Propagation Delay (tpd) — 0.6 ns (typical)
Package / Case — 356-LBGA (35 mm x 35 mm)
Supplier Device Package — 356-BGA
Configuration Memory — SRAM (volatile, unlimited reconfigures)

Datasheets & Resources

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