EPF10K100EQC240-3N vs EPF10K130EQC240-3N Comparison

Detailed side-by-side comparison of EPF10K100EQC240-3N by Intel and EPF10K130EQC240-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K130EQC240-3N EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel

EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel

EPF10K130EQC240-3N ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K100EQC240-3N EPF10K130EQC240-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Series FLEX 10KE FLEX 10KE
Family FLEX 10KE (Embedded Programmable Logic Device) FLEX-10KE®
Logic Elements / Cells 4,992 —
Total System Gates 100,000 (typical) —
Logic Array Blocks (LABs) 624 832
Embedded Array Blocks (EABs) 16 —
Maximum User I/Os 189 —
Total RAM Bits 49,152 65,536 bits
Number of PLLs 4 —
Propagation Delay 0.6 ns —
Maximum Internal Frequency 200 MHz —
Core Voltage 2.5 V 2.5 V (2.375 V to 2.625 V)
I/O Supply Voltage 3.3 V (5 V tolerant with PCI clamping) —
Process Technology 0.22 µm CMOS —
Package Type 240-pin BFQFP (Power Quad Flat Pack) —
Operating Temperature 0 °C to +70 °C (Commercial) 0 °C to +70 °C (Commercial)
JTAG Support IEEE Std. 1149.1 boundary-scan —
Mounting Type Surface Mount Surface Mount
Lead-Free / RoHS Pb-free matte tin (N suffix) —
Configuration Memory Companion EPC2LC20N or compatible —
Logic Elements — 6,656
Number of I/O Pins — 186
Number of Gates — 342,000 (typical 49,152)
Maximum Frequency — 200 MHz
Technology — 0.22 µm CMOS, SRAM-based
Package — 240-BQFP (PQFP), 32 x 32 mm
Lead Finish — Gull-wing, lead-free (per Altera datasheet)
RoHS Status — Compliant
Configuration Method — SRAM (volatile, requires external PROM)
PLLs — 4
Embedded Multipliers — Yes (EABs configurable as multipliers)
Supply Voltage I/O — 3.3 V LVTTL/LVCMOS, 5 V tolerant inputs

Datasheets & Resources

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