EPF10K130EFC672-2 vs EPF10K200EBI600-2N Comparison
Detailed side-by-side comparison of EPF10K130EFC672-2 by Altera and EPF10K200EBI600-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K130EFC672-2 | EPF10K200EBI600-2N |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 6,656 | — |
| Total Gates | ~130,000 | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (RAM bits) | 65,536 | — |
| Maximum User I/Os | 413 | — |
| Number of I/O Pins | 672 (package pins) | — |
| Package | 672-ball FineLine BGA | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | 2.5 V (2.3 V to 2.7 V) |
| Propagation Delay (typ.) | 0.6 ns | — |
| Internal Operating Frequency (max) | 333.33 MHz | — |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (commercial) |
| Speed Grade | -2 | — |
| Programming Method | SRAM-based, JTAG (IEEE 1149.1) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Typical Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Logic Elements (LEs) | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 98,304 |
| User I/O Pins | — | 470 |
| Dedicated Inputs | — | 6 |
| Technology / Process | — | 0.22 µm CMOS SRAM |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (5 V tolerant I/O available) |
| Propagation Delay | — | 0.4 ns to 0.6 ns (per LE) |
| Maximum Internal Frequency | — | 200 MHz |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance status] |