EPF10K130EFI484-2 vs EPF10K130EFC484-3 Comparison
Detailed side-by-side comparison of EPF10K130EFI484-2 by Intel and EPF10K130EFC484-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K130EFI484-2 | EPF10K130EFC484-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 6,656 | — |
| Equivalent Gate Count | 130,000 gates | — |
| Total RAM Bits | 65,536 bits | — |
| User I/Os | 274 | — |
| Number of Logic Array Blocks | 1,664 LABs | — |
| Number of Embedded Array Blocks | [DATA_NEEDED: EAB count] | — |
| Internal Clock Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns | 0.6 ns (per LE) |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (PCI-compliant) | — |
| Process Technology | 0.22 µm CMOS | — |
| Operating Temperature | 0 °C to 70 °C (commercial) | 0 C to +70 C (commercial) |
| Package | 484-ball FineLine BGA (FBGA-484) | 484-pin FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (LEs) | — | 6,656 |
| Typical Gate Count | — | 130,000 system gates |
| Logic Array Blocks (LABs) | — | 832 |
| Embedded Memory (EABs) | — | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | — | 369 |
| Supply Voltage (Core) | — | 3.3 V |
| I/O Voltage Support | — | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Speed Grade | — | -3 |
| Configuration Method | — | SRAM-based, serial or parallel, requires external configuration device |
| Logic Family | — | CMOS (SRAM-based) |