EPF10K200EBC600-1 vs EPF10K200EBC600-3 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-1 by Intel and EPF10K200EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-1 EPF10K200EBC600-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Product Type Field Programmable Gate Array (FPGA) —
Device Family FLEX-10KE —
Logic Elements 9,984 —
Embedded Memory 98,304 bits —
Logic Array Blocks 1,248 LABs —
I/O Count 470 I/O —
Supply Voltage 2.5 V —
Package 600-BGA 600-ball FineLine BGA, 45 x 45 mm
Technology Mixed CMOS —
Commercial Temperature 85 C —
Propagation Delay 0.4 ns —
Embedded Array Enhanced embedded array —
Memory Feature Dual-port memory —
RoHS Status unknown [DATA_NEEDED: RoHS compliance status]
Configuration Interface [DATA_NEEDED: configuration interface] —
Package Dimensions [DATA_NEEDED: package dimensions] —
Operating Current [DATA_NEEDED: operating current] —
Pinout [DATA_NEEDED: 600-BGA ball map] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — FLEX 10KE
Series — FLEX-10KE
System Gates — 200,000
Logic Elements / Cells — 9,984
Logic Array Blocks (LABs) — 1248
Embedded Memory (EABs) — 24,576 bits
Maximum User I/O — 470
Number of PLLs — 4
Core Voltage — 2.5 V (2.375 V to 2.625 V)
Process Technology — 0.22 micrometer SRAM
Speed Grade — -3 (commercial)
Mounting Type — Surface Mount
Operating Temperature — 0C to +70C (commercial)
JTAG Support — Yes (IEEE 1149.1 boundary-scan)

Datasheets & Resources

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