EPF10K200EBC600-1 vs EPF10K200SBC600-1 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-1 by Intel and EPF10K200SBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-1 EPF10K200SBC600-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Product Type Field Programmable Gate Array (FPGA) —
Device Family FLEX-10KE —
Logic Elements 9,984 —
Embedded Memory 98,304 bits —
Logic Array Blocks 1,248 LABs —
I/O Count 470 I/O —
Supply Voltage 2.5 V —
Package 600-BGA 600-ball BGA, 45 × 45 mm, 1.27 mm pitch
Technology Mixed CMOS —
Commercial Temperature 85 C —
Propagation Delay 0.4 ns 0.4 ns
Embedded Array Enhanced embedded array —
Memory Feature Dual-port memory —
RoHS Status unknown Non-compliant (per third-party listing)
Configuration Interface [DATA_NEEDED: configuration interface] —
Package Dimensions [DATA_NEEDED: package dimensions] —
Operating Current [DATA_NEEDED: operating current] —
Pinout [DATA_NEEDED: 600-BGA ball map] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — FLEX-10KS
Series — EPF10K200
Logic Elements / Cells — 9,984
Gate Count (typical) — 200,000 gates
Logic Array Blocks (LABs) — 1,248
Number of User I/Os — 470
Number of Logic Cells — 4,992
Embedded RAM (bits) — 24,576 (across EABs)
Max Internal Frequency — 250 MHz
Process Technology — 0.22 µm CMOS
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V (typ. 2.5 V)
Speed Grade — -1 (fastest commercial)
Operating Temperature — 0 °C to 70 °C (Commercial)
Mounting Type — Surface Mount
JTAG Support — IEEE Std 1149.1
Configuration — Serial via EPC2/EPC8 configuration devices

Datasheets & Resources

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