EPF10K200EFC672-2 vs EPF10K200EFC672-1 Comparison
Detailed side-by-side comparison of EPF10K200EFC672-2 by Intel and EPF10K200EFC672-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200EFC672-2 | EPF10K200EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Last Time Buy |
| Family | FLEX 10KE | FLEX-10KE |
| Logic Elements | 9,984 | 9,984 |
| Typical Gates | 200,000 | 200,000 |
| Maximum User I/Os | 470 | — |
| Embedded Memory | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Logic Array Blocks (LABs) | 624 | 1,248 |
| Package | 672-BBGA (FineLine BGA) | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Package Dimensions | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Process Technology | 0.22 um CMOS | CMOS, SRAM-based |
| Speed Grade | -2 | -1 |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Operating Temperature | 0 C to 70 C | 0 C to 70 C (Commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Programmability | JTAG (IEEE 1149.1) / in-system | — |
| RoHS Status | Compliant (per distributor listing) | Compliant |
| Logic Family | CMOS | — |
| User I/Os | — | 470 |
| Embedded Memory (bits) | — | 98,304 |
| Mounting Type | — | Surface Mount |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | — | 2.5 V (typical, FLEX-10KE) |
| Supply Voltage - Max | — | 3.3 V (I/O) |
| MSL Level | — | 3 (168 hours) |