EPF10K200EGC599-1 vs EPF10K250EGC599-3 Comparison
Detailed side-by-side comparison of EPF10K200EGC599-1 by Intel and EPF10K250EGC599-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Last Time BuyAltera
EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel
EPF10K250EGC599-3 ⚠ Last Time BuySpecification Comparison
| Parameter | EPF10K200EGC599-1 | EPF10K250EGC599-3 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | 250,000 |
| Embedded Array Blocks (EABs) | 470 | 12 |
| Total RAM Bits | 98,304 | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| Pin Count | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | — |
| Mounting Type | Through-Hole (Socket or Solder) | Through-hole PGA |
| Operating Temperature | 0C to +70C (Commercial) | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| RoHS Status | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 12,160 |
| Embedded Memory (Bits) | — | 409,600 |
| Maximum User I/O | — | 470 |
| Package | — | 599-pin PGA (HIPGA / Heat-dissipating PGA) |
| Package Pin Count | — | 599 |
| Speed Grade | — | -3 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 3.3 V |
| I/O Voltage Support | — | 3.3 V / 2.5 V / 1.8 V (MultiVolt) |
| Process Technology | — | 0.22 micron CMOS, SRAM-based configuration |
| Configuration Method | — | Serial or parallel, SRAM configuration cell |
| Terminal Form | — | PIN/PEG |