EPF10K200SBC356-1X vs EPF10K200SBC356-1 Comparison

Detailed side-by-side comparison of EPF10K200SBC356-1X by Intel and EPF10K200SBC356-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K200SBC356-1X EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel

EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel

EPF10K200SBC356-1X ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K200SBC356-1X EPF10K200SBC356-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy NRND
Family FLEX 10KE FLEX 10K (Classic embedded array)
Series FLEX-10KS —
Typical System Gates 200,000 —
Maximum System Gates 513,000 —
Logic Elements (LEs) 9,984 —
Logic Array Blocks (LABs) 1,248 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 39,616 98,304
User I/Os 274 —
Process Technology 0.22 µm CMOS —
Core Voltage (VCCINT) 2.5 V (2.375 V to 2.625 V) —
I/O Voltage (VCCIO) 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) —
Package 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Operating Temperature Grade Commercial —
Speed Grade -1 (fastest commercial bin) —
Mounting Type Surface Mount (BGA) Surface Mount
JTAG Support IEEE Std. 1149.1 boundary scan + ISP —
Lead Free / RoHS Yes (per -1X suffix) —
Configuration Mode SRAM-based, ISP via JTAG —
Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1,248
Equivalent Gate Count — 200,000 (system gates ~513,000)
Number of User I/Os — 274
Propagation Delay — 0.4 ns (-1 speed grade)
Core Supply Voltage — 2.375 V to 2.625 V
Operating Temperature — 0 °C to 70 °C (commercial)
Logic Family / Process — CMOS SRAM LUT
Configuration Method — SRAM (volatile) - requires configuration device or JTAG
RoHS Status — [DATA_NEEDED: RoHS status]
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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