EPF10K200SFC484-2X vs EPF10K200SFC484-1X Comparison
Detailed side-by-side comparison of EPF10K200SFC484-2X by Intel and EPF10K200SFC484-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200SFC484-2X | EPF10K200SFC484-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Series | FLEX 10KS | FLEX 10KS |
| Family | FLEX 10K | FLEX 10K Embedded Programmable Logic Device |
| Number of Logic Elements / Cells | 9984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98304 | 98304 |
| Number of Gates | 200000 (typical) | — |
| Number of I/O | 369 | — |
| Core Voltage - Supply | 2.375 V to 2.625 V | — |
| Operating Frequency (max) | 250 MHz (family-typical, -2 speed grade) | — |
| Operating Temperature | 0C to +70C (commercial) | 0 °C to +70 °C (Commercial) |
| Package / Case | 484-BBGA (FineLine BGA) | — |
| Supplier Device Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | CMOS, SRAM-based configuration | — |
| Configuration Memory | External serial (EPC1/EPC2 family compatible) | — |
| JTAG Support | IEEE 1149.1-1990 boundary-scan | — |
| Process Technology | [DATA_NEEDED: process node nm] | 0.22 µm CMOS |
| RoHS Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements / Cells | — | 9984 |
| Number of LABs/CLBs | — | 1248 |
| User I/O Count | — | 369 |
| Supply Voltage (Core) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Maximum Internal Frequency | — | 250 MHz |
| Propagation Delay | — | 0.4 ns |
| Package | — | 484-BBGA / FBGA-484 (23 x 23 mm, 1.0 mm pitch, fine line) |