EPF10K200SFC484-2X vs EPF10K200SFC484-3N Comparison
Detailed side-by-side comparison of EPF10K200SFC484-2X by Intel and EPF10K200SFC484-3N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200SFC484-2X | EPF10K200SFC484-3N |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Series | FLEX 10KS | FLEX-10KS |
| Family | FLEX 10K | FLEX 10KE |
| Number of Logic Elements / Cells | 9984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98304 | — |
| Number of Gates | 200000 (typical) | — |
| Number of I/O | 369 | — |
| Core Voltage - Supply | 2.375 V to 2.625 V | — |
| Operating Frequency (max) | 250 MHz (family-typical, -2 speed grade) | — |
| Operating Temperature | 0C to +70C (commercial) | 0°C to +70°C (commercial, N suffix) |
| Package / Case | 484-BBGA (FineLine BGA) | — |
| Supplier Device Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | CMOS, SRAM-based configuration | — |
| Configuration Memory | External serial (EPC1/EPC2 family compatible) | — |
| JTAG Support | IEEE 1149.1-1990 boundary-scan | IEEE 1149.1 BST |
| Process Technology | [DATA_NEEDED: process node nm] | 0.22 µm CMOS SRAM |
| RoHS Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 200,000 |
| Logic Elements (LEs) | — | 9,984 |
| LABs | — | 1,248 |
| Embedded Array Blocks (EABs) | — | 4 (up to 24 Kbit RAM) |
| User I/O Pins | — | 369 |
| Package | — | 484-ball FineLine BGA |
| Speed Grade | — | -3 (fastest) |
| Core Voltage (VCCINT) | — | 5.0 V |
| I/O Voltage Support | — | 2.5 V / 3.3 V / 5.0 V |
| PCI Compliance | — | 3.3 V/33 MHz and 66 MHz (speed grade -3) |