EPF10K200SFC672-1X vs EPF10K200EFC672-1 Comparison
Detailed side-by-side comparison of EPF10K200SFC672-1X by Intel and EPF10K200EFC672-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200SFC672-1X | EPF10K200EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last Time Buy |
| Series | FLEX-10KS | — |
| Family | FLEX 10K (legacy) | FLEX-10KE |
| Architecture | Reconfigurable CMOS SRAM | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gate count] | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 24 | — |
| Embedded RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) | — |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) | — |
| Operating Temperature | 0 °C to 70 °C (Commercial) | 0 C to 70 C (Commercial) |
| Package | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) | — |
| Design Tool | Quartus (legacy FLEX 10K support) | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| User I/Os | — | 470 |
| Embedded Memory (bits) | — | 98,304 |
| Process Technology | — | CMOS, SRAM-based |
| Speed Grade | — | -1 |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | — | 2.5 V (typical, FLEX-10KE) |
| Supply Voltage - Max | — | 3.3 V (I/O) |
| MSL Level | — | 3 (168 hours) |