EPF10K250EBI600-3 vs EPF10K200SBC600-3 Comparison
Detailed side-by-side comparison of EPF10K250EBI600-3 by Intel and EPF10K200SBC600-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Last Time BuySpecification Comparison
| Parameter | EPF10K250EBI600-3 | EPF10K200SBC600-3 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | 9,984 cells |
| Typical Gate Count | 250,000 system gates | — |
| Embedded System Blocks (ESBs) | 12 | — |
| Maximum User I/O | 470 | — |
| Dedicated Inputs | 4 | — |
| PLLs | 4 | — |
| On-chip RAM | Up to 40 Kbits | — |
| Package | 600-ball BGA (HBGA) | 600-ball BGA (PBGA600, 45 x 45 mm, 1.27 mm pitch) |
| Ball Pitch | 1.93 mm | — |
| Core Voltage | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] | 2.5 V |
| Operating Temperature | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] | 0 °C to 70 °C (commercial) |
| Speed Grade | -3 (fastest) | — |
| Process Technology | 0.22 µm CMOS, 4-layer metal | 0.22 µm CMOS |
| Configuration Method | SRAM, requires external configuration device (EPC series) | SRAM (external PROM required) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Not specified (SnPb / tin-lead finish per legacy distributor listing) | [DATA_NEEDED: RoHS status] |
| Lead-free | no (legacy tin-lead per distributor description) | — |
| Gate Count | — | 200,000 gates |
| Logic Array Blocks (LABs) | — | 1,248 |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/Os | — | 470 |
| Maximum Internal Frequency | — | 166.67 MHz |
| Programming Support | — | JTAG / Altera Quartus legacy |
| Status | — | Obsolete (last Altera shipment) |