EPF10K250EGC599-3 vs EPF10K200EGC599-1 Comparison
Detailed side-by-side comparison of EPF10K250EGC599-3 by Altera and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Altera
EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel
EPF10K250EGC599-3 ⚠ Last Time BuyIntel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Last Time BuySpecification Comparison
| Parameter | EPF10K250EGC599-3 | EPF10K200EGC599-1 |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | — |
| Typical Gates | 250,000 | 200,000 |
| Embedded Memory (Bits) | 409,600 | — |
| Embedded Array Blocks (EABs) | 12 | 470 |
| Maximum User I/O | 470 | — |
| Package | 599-pin PGA (HIPGA / Heat-dissipating PGA) | — |
| Package Pin Count | 599 | — |
| Speed Grade | -3 | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Core Voltage | 3.3 V | — |
| I/O Voltage Support | 3.3 V / 2.5 V / 1.8 V (MultiVolt) | — |
| Process Technology | 0.22 micron CMOS, SRAM-based configuration | — |
| Configuration Method | Serial or parallel, SRAM configuration cell | — |
| Mounting Type | Through-hole PGA | Through-Hole (Socket or Solder) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| Terminal Form | PIN/PEG | — |
| Logic Elements (LEs) | — | 9,984 |
| Total RAM Bits | — | 98,304 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | — | 5.0 V tolerant |
| Pin Count | — | 599 |
| Package Type | — | 599-BCPGA (Ceramic Pin Grid Array) |
| Package Dimensions | — | 62.48 x 62.48 mm |
| Operating Temperature | — | 0C to +70C (Commercial) |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| PLLs | — | 4 |