EPF10K250EGI599-3 vs EPF10K250EGC599-2 Comparison
Detailed side-by-side comparison of EPF10K250EGI599-3 by Intel and EPF10K250EGC599-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EGI599-3 | EPF10K250EGC599-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Series | FLEX 10KE | — |
| Family | FLEX 10K Embedded Programmable Logic Device | FLEX 10KE |
| Logic Elements (LEs) | 12,160 | — |
| Typical Gates | 250,000 | 250,000 |
| Maximum User I/O | 488 | — |
| Embedded Array Blocks (EABs) | 20 | 12 |
| Total RAM Bits | 40,960 | 24,576 bits |
| Core Voltage | 2.5 V | 5 V |
| Supply Voltage Range | 2.3 V min | — |
| Speed Grade | –3 | -2 |
| Operating Temperature | –40 °C to +85 °C (Industrial) | — |
| Package | PGA-599 | 599-BCPGA (CPGA-599 / HIPGA-599) |
| Mounting Type | Through-Hole (PGA) | Through-Hole (Pin Grid Array) |
| Process Technology | 0.25 µm CMOS, SRAM-based | — |
| Configuration Mode | Passive Serial, Active Serial, JTAG | — |
| RoHS Status | Non-RoHS Compliant | Unknown (legacy ceramic PGA) |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 12,160 LEs |
| Maximum User I/O Pins | — | 470 |
| Number of PLLs | — | 4 |
| Operating Temperature Grade | — | Commercial |
| Configuration Method | — | SRAM / EPROM |
| JTAG Support | — | IEEE 1149.1 Boundary Scan |
| Lifecycle Status | — | Not Recommended for New Designs (NRND) |