EPF10K30EFC256-2N vs EPF10K100EFC256-2 Comparison

Detailed side-by-side comparison of EPF10K30EFC256-2N by Intel and EPF10K100EFC256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-2N EPF10K100EFC256-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Series FLEX 10KE FLEX 10KE
Family FLEX 10KE Embedded Programmable Logic Family —
Typical Gates 30,000 —
Logic Elements (LEs) 1,728 —
Embedded RAM Bits 24,576 —
Embedded Array Blocks (EABs) 6 —
User I/Os 246 191
Logic Cells 1728 —
Propagation Delay 0.6 ns (per digchip listing; internal frequency 80 MHz) —
Number of Logic Elements 24576 —
Operating Temperature 0 °C to +70 °C (Commercial) 0 °C to +70 °C (Commercial)
Supply Voltage [DATA_NEEDED: core and I/O rail voltages] —
Process Technology 0.22 µm CMOS, SRAM-based 0.22 µm CMOS SRAM
Package 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch 256-FBGA (FineLine BGA, 17 x 17 mm)
Mounting Type Surface Mount Surface Mount (BGA)
Configuration Passive Serial / Active Serial / JTAG —
Lead Free / RoHS Non-RoHS (legacy, SnPb finish per FBGA-256 family) —
Speed Grade -2N (mid-grade, 0.6 ns) —
Manufacturer — Intel (formerly Altera)
Logic Elements / Cells — 4,992 (49,152 user logic elements)
Number of LABs — 624
Total RAM Bits — [DATA_NEEDED: total EAB RAM bits]
Number of Gates — 100,000 equivalent
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V
Logic Family — CMOS (SRAM-based)
Propagation Delay (per LUT) — ~0.6 ns (speed grade -2)
Configuration Method — PS, JTAG, in-system programmable
RoHS Status — [DATA_NEEDED: RoHS compliance]
Embedded Array Blocks — Yes (EAB for RAM/ROM/DSP)

Datasheets & Resources

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