EPF10K30EFC256-2N vs EPF10K30EFC256-2X Comparison

Detailed side-by-side comparison of EPF10K30EFC256-2N by Intel and EPF10K30EFC256-2X by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-2N EPF10K30EFC256-2X
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Series FLEX 10KE FLEX-10KE
Family FLEX 10KE Embedded Programmable Logic Family FLEX 10KE
Typical Gates 30,000 —
Logic Elements (LEs) 1,728 —
Embedded RAM Bits 24,576 —
Embedded Array Blocks (EABs) 6 —
User I/Os 246 —
Logic Cells 1728 —
Propagation Delay 0.6 ns (per digchip listing; internal frequency 80 MHz) 0.6 ns
Number of Logic Elements 24576 —
Operating Temperature 0 °C to +70 °C (Commercial) 0°C to 70°C
Supply Voltage [DATA_NEEDED: core and I/O rail voltages] —
Process Technology 0.22 µm CMOS, SRAM-based —
Package 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface Mount
Configuration Passive Serial / Active Serial / JTAG —
Lead Free / RoHS Non-RoHS (legacy, SnPb finish per FBGA-256 family) —
Speed Grade -2N (mid-grade, 0.6 ns) -2
Gates — 30,000
Logic Elements / Cells — 1,728
Number of LABs/CLBs — 216
Number of Logic Elements/Cells — 1,728
Total RAM Bits — 24,576
Number of I/O — 176
Voltage - Supply — 2.375 V to 2.625 V
Internal Frequency (Max) — 200 MHz
Technology — 0.22 µm CMOS
Supplier Device Package — 256-FBGA (17x17)
Package / Case — 256-BGA
RoHS Status — [DATA_NEEDED: RoHS status]

Datasheets & Resources

Browse All Products Create BOM Request Quote