EPF10K30EQC208-1N vs EPF10K30EQC208-3N Comparison

Detailed side-by-side comparison of EPF10K30EQC208-1N by Intel and EPF10K30EQC208-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K30EQC208-3N EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

EPF10K30EQC208-3N ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K30EQC208-1N EPF10K30EQC208-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family FLEX 10KE FLEX 10KE
Logic Elements / Cells 1,728 1,728
Total RAM Bits 24,576 24,576
Typical Gate Count 30,000 gates —
Number of LABs / CLBs 216 —
Number of User I/O 147 —
Number of Gates 119,000 —
Internal Frequency (max) 250 MHz —
Propagation Delay 0.6 ns 0.6 ns (typical)
Core Voltage VCCINT 2.375 V to 2.625 V (nominal 2.5 V) —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Operating Temperature 0 C to 70 C (commercial) 0 °C to +70 °C (commercial)
Mounting Type Surface Mount Surface Mount
Package / Case 208-BFQFP (PQFP-208, 28x28 mm) —
Configuration Method SRAM-based, ISP via JTAG —
Part Status Obsolete (last-time-buy may apply) —
Typical Gates — 30,000
Logic Array Blocks (LABs) — 216
User I/Os — 147
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Internal Frequency — 200 MHz
Core Voltage — 2.5 V
Package — 208-pin PQFP (BFQFP, plastic)
Configuration Memory — SRAM (volatile, requires external PROM)
JTAG Support — IEEE 1149.1 boundary-scan
Lead-Free / RoHS — Lead-free per package marking; RoHS compliance [DATA_NEEDED]

Datasheets & Resources

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