EPF10K30EQC208-3 vs EPF10K30EQC208-3N Comparison

Detailed side-by-side comparison of EPF10K30EQC208-3 by Intel and EPF10K30EQC208-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K30EQC208-3N EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

EPF10K30EQC208-3N ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K30EQC208-3 EPF10K30EQC208-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Last Time Buy
Product Type FPGA (Field Programmable Gate Array) —
Family FLEX 10KE FLEX 10KE
Logic Elements / Cells 1,728 1,728
Total Gates 30,000 —
Embedded Memory Bits 24,576 —
Embedded Array Blocks (EABs) 12 —
User I/Os 246 147
Package 208-PQFP (BFQFP) 208-pin PQFP (BFQFP, plastic)
Pin Count 208 —
Terminal Form Gull Wing —
Speed Grade -3 —
Propagation Delay 0.6 ns 0.6 ns (typical)
Internal Frequency 80 MHz (typical), 200 MHz (max) 200 MHz
Core Supply Voltage 2.5 V —
Operating Temperature 0 C to 70 C (Commercial) 0 °C to +70 °C (commercial)
Process Technology CMOS 0.22 µm CMOS
Logic Family CMOS —
JTAG (IEEE 1149.1) Supported —
Configuration Scheme Serial Passive / ISP —
Typical Gates — 30,000
Total RAM Bits — 24,576
Logic Array Blocks (LABs) — 216
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage — 2.5 V
Mounting Type — Surface Mount
Configuration Memory — SRAM (volatile, requires external PROM)
JTAG Support — IEEE 1149.1 boundary-scan
Lead-Free / RoHS — Lead-free per package marking; RoHS compliance [DATA_NEEDED]

Datasheets & Resources

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