EPF10K50ETC144-3 vs EPF10K50ETC144-1 Comparison
Detailed side-by-side comparison of EPF10K50ETC144-3 by Intel and EPF10K50ETC144-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K50ETC144-3 | EPF10K50ETC144-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gate Count | 50,000 gates | — |
| Logic Elements / Cells | 2,880 | — |
| Total Memory Bits | 40,960 bits | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| User I/O Pins (this package) | 102 | — |
| Max User I/O (family) | 274 pins | — |
| Number of Pins | 144 | — |
| Package Type | TQFP-144 (also referred to as 144-LQFP) | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Maximum Internal Frequency | 166.67 MHz | — |
| Internal Frequency (per DigChip summary) | 66.67 MHz | — |
| Process Technology | 0.22 µm CMOS | CMOS |
| Core Supply Voltage | 2.5 V | — |
| Logic Family | CMOS | — |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Memory | SRAM (volatile) | — |
| JTAG Support | IEEE 1149.1 boundary scan | — |
| RoHS Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: rohs_status] |
| Series | — | FLEX 10KE |
| Typical Gates | — | 50,000 |
| Logic Elements (LEs) | — | 2,880 |
| Embedded Memory (RAM bits) | — | 40,960 |
| Number of User I/O | — | 102 |
| Number of I/O Pins (package) | — | 144 |
| Package | — | 144-LQFP (TQFP) |
| Core Voltage | — | 2.5 V |
| Internal Frequency (max) | — | 66.67 MHz |