EPF10K70RC240-2 vs EPF10K70RC240-2N Comparison

Detailed side-by-side comparison of EPF10K70RC240-2 by Intel and EPF10K70RC240-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K70RC240-2 EPF10K70RC240-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 10K —
Logic Elements / Cells 3,744 3,744
Total Gates 70,000 (typical) 70,000 (typical)
Number of LABs/CLBs 468 —
Number of Flip-Flops 18,432 —
Embedded Array Blocks (EABs) 9 —
Maximum User I/O 189 —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Operating Supply Voltage 5 V —
Process Technology 0.42 µm CMOS 0.42 µm
Maximum Internal Frequency 125 MHz —
Speed Grade -2 —
Operating Temperature 0°C to +70°C (commercial) 0 °C to 70 °C (Commercial)
Package 240-BFQFP Exposed Pad (RQFP, gull-wing) —
Mounting Type Surface Mount Surface Mount
Programmability SRAM-based, in-system programmable —
Configuration Interface Serial configuration EPROM, JTAG (IEEE 1149.1) —
RoHS Status unknown [DATA_NEEDED: RoHS compliance flag]
Series — FLEX 10K
System Gates — 118,000
Number of LABs — 468
Embedded Memory (bits) — 18,432
User I/O Pins — 189
Supply Voltage — 5 V
Logic Family — CMOS
Maximum Operating Frequency — 125 MHz
Propagation Delay — 0.4 ns
Package Type — 240-RQFP (BFQFP with exposed pad)
Configuration Technology — SRAM-based (volatile, requires external config ROM)
Programming Interface — JTAG / passive serial

Datasheets & Resources

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