EPF10K70RC240-4 vs EPF10K70RC240-2N Comparison

Detailed side-by-side comparison of EPF10K70RC240-4 by Intel and EPF10K70RC240-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K70RC240-4 EPF10K70RC240-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family Flex 10K —
Logic Cells (LEs) 3,744 —
Typical Gates 70,000 —
Flipflops 18,432 —
Logic Array Blocks (LABs) 468 —
User I/Os 189 —
Package 240-RQFP (RQFP-240) Exposed Pad, 32 x 32 mm —
Core Supply Voltage 5 V (4.75 V to 5.25 V) —
I/O Voltage 3.3 V or 5 V —
Maximum Operating Frequency 125 MHz 125 MHz
Propagation Delay 0.4 ns 0.4 ns
Process Technology 0.42 um CMOS 0.42 µm
Speed Grade -4 —
Operating Temperature 0 C to +70 C (Commercial) 0 °C to 70 °C (Commercial)
Mounting Type Surface Mount Surface Mount
Configuration Method Serial PROM / JTAG (IEEE 1149.1) —
Embedded Array Blocks Yes (RAM, ROM, megafunctions) —
RoHS Status Non-compliant (legacy 5 V part) [DATA_NEEDED: RoHS compliance flag]
Lead-Free No (legacy SnPb process) —
Series — FLEX 10K
Logic Elements / Cells — 3,744
Total Gates — 70,000 (typical)
System Gates — 118,000
Number of LABs — 468
Embedded Memory (bits) — 18,432
User I/O Pins — 189
Supply Voltage — 5 V
Logic Family — CMOS
Package Type — 240-RQFP (BFQFP with exposed pad)
Configuration Technology — SRAM-based (volatile, requires external config ROM)
Programming Interface — JTAG / passive serial

Datasheets & Resources

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