EPF6010ANTC100-2 vs EPF6010ANTC100-3 Comparison

Detailed side-by-side comparison of EPF6010ANTC100-2 by Intel and EPF6010ANTC100-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF6010ANTC100-3 EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel

EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel

EPF6010ANTC100-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF6010ANTC100-2 EPF6010ANTC100-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family FLEX 6000 / FLEX 6000A FLEX 6000
Logic Elements 880 880 LE
Programmable I/O Pins 71 —
Package 100-pin TQFP (14x14 mm, 0.5 mm pitch) 100-TQFP
Speed Grade -2 -3
Operating Temperature Commercial (0C to +70C) —
Configuration Method SRAM (volatile), in-system programmable —
Programming Interface IEEE 1149.1 (JTAG) / passive serial / EPC configuration device —
Supply Voltage (VCCINT) 5.0 V (FLEX 6000A); 3.3 V (FLEX 6000) —
I/O Standards Supported TTL, CMOS, PCI (with clamping diodes) LVTTL, LVCMOS, PCI (MultiVolt I/O)
Number of LABs [DATA_NEEDED: LAB count] —
Embedded Memory [DATA_NEEDED: embedded RAM blocks] 16000 bit
Global Clock Networks [DATA_NEEDED: global clock count] —
Mounting Type Surface Mount Surface Mount
MSL Level 3 (168 hours) —
Packaging Tray (per Altera packing standard) —
RoHS Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
User I/O Count — 71
Number of Logic Array Blocks (LABs) — 8
Core Voltage — 5 V
Process Technology — 0.42 µm CMOS SRAM
Configuration Interface — JTAG (IEEE 1149.1) / Serial / Parallel
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Programmable Interconnect — Continuous FastTrack

Datasheets & Resources

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