EPF6010ATC144-3N vs EPF6016ATC144-3N Comparison
Detailed side-by-side comparison of EPF6010ATC144-3N by Intel and EPF6016ATC144-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6010ATC144-3N | EPF6016ATC144-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements / Cells | 880 | — |
| Number of Gates | 10,000 | — |
| Number of LABs/CLBs | 88 | — |
| Number of User I/Os | 102 | — |
| Number of Logic Elements/Cells | 880 | — |
| Supply Voltage | 3.3 V | — |
| Process Technology | 0.42 µm CMOS, SRAM-based | 0.42 micron CMOS |
| Internal Performance | 200 MHz | — |
| Configuration Memory | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) + passive serial/parallel | JTAG (IEEE 1149.1) |
| Package | 144-pin TQFP (20x20 mm, 1.0 mm pitch) | TQFP-144 |
| Supplier Device Package | 144-TQFP | — |
| Mounting Style | Surface Mount (SMD) | — |
| Operating Temperature | 0 °C to 85 °C | Commercial (0C to +70C) |
| Speed Grade | -3 | -3 |
| Part Status | Obsolete (End of Life) | — |
| Packaging | Tray | — |
| Architecture | — | OptiFLEX |
| Logic Elements | — | 1,320 |
| Logic Array Blocks (LABs) | — | 132 |
| Typical Gate Count | — | 16,000 gates |
| User I/O Pins | — | 117 |
| Maximum Internal Frequency | — | 142.86 MHz |
| Core Supply Voltage | — | 3.3 V |
| Configuration Memory Type | — | SRAM (volatile) |
| Mounting Type | — | Surface Mount |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |