EPF6016AQC208-3S vs EPF6016AQC208-3N Comparison

Detailed side-by-side comparison of EPF6016AQC208-3S by Intel and EPF6016AQC208-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6016AQC208-3S EPF6016AQC208-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Series FLEX 6000 —
Device Type Field-Programmable Gate Array (FPGA) —
Typical Gates 16,000 —
Logic Elements 1,320 —
Logic Array Blocks (LABs) 132 132
User I/O Pins 171 —
Package Type 208-PQFP (Plastic Quad Flat Pack) —
Package Code FQFP, 28x28 mm, 0.5 mm pitch —
Supply Voltage - Core 3.3 V —
Supply Voltage - Operating 3.0 V to 3.6 V —
Operating Temperature (TJ) 0C to 85C —
Configuration Memory SRAM (volatile, requires external PROM) SRAM (volatile, requires config device)
I/O Standards 3.3V LVCMOS/LVTTL, 5V tolerant inputs —
JTAG Support IEEE 1149.1 Boundary-Scan —
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: confirm RoHS compliance status] [DATA_NEEDED: RoHS status]
Speed Grade -3 (highest speed in family) -3
Family — FLEX 6000
Logic Elements / Cells — 1,320
Equivalent Gates — 16,000
Maximum User I/Os — 171
Operating Frequency (max) — 142.86 MHz
Supply Voltage — 3.3 V
Process Technology — 0.42 µm CMOS
Package — 208-PQFP (28x28 mm)
Pin Count — 208
Operating Temperature — 0 °C to 85 °C (Commercial)
Lifecycle Status — Obsolete (EOL)

Datasheets & Resources

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