EPF6016BC256-3 vs EPF6024ABC256-2N Comparison

Detailed side-by-side comparison of EPF6016BC256-3 by Intel and EPF6024ABC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6016BC256-3 EPF6024ABC256-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Logic Elements (typical) 1,320 cells —
Usable Gates 16,000 gates —
User I/O Pins 204 218
Maximum Internal Frequency 172 MHz —
Process Technology 0.42 µm CMOS SRAM 0.42 µm CMOS
Core Supply Voltage 5.0 V —
I/O Standard 5.0 V TTL/CMOS —
Package 256-ball FineLine BGA 256-ball BGA (BC256)
Pin Count 256 —
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to 85 °C (commercial)
Configuration SRAM, in-system programmable —
Boundary Scan JTAG IEEE 1149.1 —
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Logic Elements / Cells — 1,960
Gate Count — 24,000 gates
Logic Array Blocks (LABs) — 196
Supply Voltage — 3.3 V
Internal Frequency (max) — 172 MHz
JTAG / Boundary Scan — Yes (JTAG BST)
I/O Features — Slew-rate control, tri-state buffers
Setup Time — 2 ns (typical via FastTrack)
Hold Time — 0 ns
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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