EPF6016BC256-3N vs EPF6016AFC256-3 Comparison

Detailed side-by-side comparison of EPF6016BC256-3N by Intel and EPF6016AFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6016BC256-3N EPF6016AFC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Device Type Field Programmable Gate Array (FPGA) FPGA (Field Programmable Gate Array)
Logic Elements (LEs) 1320 1320
Typical Gate Count 16,000 gates —
User I/Os 204 171
Internal Frequency (max) 125 MHz —
Process Technology 0.42 µm CMOS 0.42 µm CMOS
Supply Voltage 5 V —
Package 256-BGA (FineLine) 256-ball FineLine BGA (FBGA)
Speed Grade -3 -3
Temperature Range 0 °C to +85 °C (industrial, N suffix) —
Configuration Method Serial configuration EPROM SRAM (volatile, requires external PROM)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Packaging Tray —
RoHS Status [DATA_NEEDED: RoHS status] —
Equivalent Gates — 16K
Logic Array Blocks (LABs) — 132
Maximum Internal Frequency — 142.86 MHz
Edge Rate — 172 MHz
Core Supply Voltage — 3.3 V
Pin Count — 256
Programming Interface — JTAG (IEEE 1149.1)
Operating Temperature — 0 °C to +85 °C (commercial)

Datasheets & Resources

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