EPF6016TC144-3N vs EPF6016TC1443N Comparison
Detailed side-by-side comparison of EPF6016TC144-3N by Intel and EPF6016TC1443N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6016TC144-3N | EPF6016TC1443N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Usable Gates | 16,000 | — |
| Logic Array Blocks (LABs) | 132 | — |
| User I/Os | 117 | — |
| Internal Frequency | 172 MHz | — |
| Package | TQFP-144 (Fine Line BGA-style TQFP) | 144-LQFP (TQFP) |
| Pin Count | 144 | — |
| Speed Grade | -3 | -3 |
| Operating Temperature | 0°C to 85°C (Commercial) | 0C to +70C (commercial) |
| Supply Voltage | 3.3 V / 5 V (per FLEX 6000 family) | 5 V |
| Configuration Memory | SRAM (volatile, requires external PROM) | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Non-compliant (legacy Altera product) |
| Logic Elements / Cells | — | 1320 |
| Number of Gates | — | 16000 |
| Number of I/O | — | 117 |
| Number of LABs/CLBs | — | 132 |
| Package Body Size | — | 20 mm x 20 mm |
| Lead Pitch | — | 0.5 mm |
| Process Technology | — | 0.5 µm CMOS SRAM |
| Configuration Method | — | SRAM (serial/parallel, requires EPC PROM) |
| Lead Free | — | No (contains lead, SnPb finish) |