EPF6016TC1443N vs EPF6016TC144-3N Comparison

Detailed side-by-side comparison of EPF6016TC1443N by Intel and EPF6016TC144-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6016TC1443N EPF6016TC144-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Logic Elements / Cells 1320 —
Number of Gates 16000 —
Number of I/O 117 —
Number of LABs/CLBs 132 —
Supply Voltage 5 V 3.3 V / 5 V (per FLEX 6000 family)
Operating Temperature 0C to +70C (commercial) 0°C to 85°C (Commercial)
Mounting Type Surface Mount Surface Mount
Package 144-LQFP (TQFP) TQFP-144 (Fine Line BGA-style TQFP)
Package Body Size 20 mm x 20 mm —
Lead Pitch 0.5 mm —
Speed Grade -3 -3
Process Technology 0.5 µm CMOS SRAM —
Configuration Method SRAM (serial/parallel, requires EPC PROM) —
RoHS Status Non-compliant (legacy Altera product) [DATA_NEEDED: RoHS status]
Lead Free No (contains lead, SnPb finish) —
Device Type — FPGA (Field Programmable Gate Array)
Usable Gates — 16,000
Logic Array Blocks (LABs) — 132
User I/Os — 117
Internal Frequency — 172 MHz
Pin Count — 144
Configuration Memory — SRAM (volatile, requires external PROM)
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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