EPF6024AFI256-2 vs EPF6024ABC256-2N Comparison

Detailed side-by-side comparison of EPF6024AFI256-2 by Intel and EPF6024ABC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024AFI256-2 EPF6024ABC256-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 6000 FLEX 6000
Series FLEX 6000 —
Typical Gates 24,000 —
Logic Elements (LEs) 1,960 —
User I/Os 196 —
Core Voltage 5.0 V —
Process Technology 0.42 µm CMOS 0.42 µm CMOS
Maximum Frequency 166.67 MHz —
Package 256-FBGA 256-ball BGA (BC256)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40 °C to +85 °C (Industrial) 0 °C to 85 °C (commercial)
Architecture OptiFLEX (LUT-based) —
Configuration SRAM (volatile, requires config device) —
I/O Compatibility MultiVolt (3.3V / 5.0V) —
RoHS Status Not RoHS compliant (SnPb) [DATA_NEEDED: RoHS status]
Logic Elements / Cells — 1,960
Gate Count — 24,000 gates
Logic Array Blocks (LABs) — 196
User I/O Pins — 218
Supply Voltage — 3.3 V
Internal Frequency (max) — 172 MHz
JTAG / Boundary Scan — Yes (JTAG BST)
I/O Features — Slew-rate control, tri-state buffers
Setup Time — 2 ns (typical via FastTrack)
Hold Time — 0 ns
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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