EPF6024AFI256-2 vs EPF6024AFC256-3 Comparison

Detailed side-by-side comparison of EPF6024AFI256-2 by Intel and EPF6024AFC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024AFI256-2 EPF6024AFC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family FLEX 6000 FLEX 6000
Series FLEX 6000 —
Typical Gates 24,000 —
Logic Elements (LEs) 1,960 —
User I/Os 196 218
Core Voltage 5.0 V —
Process Technology 0.42 µm CMOS 0.42 umm CMOS
Maximum Frequency 166.67 MHz —
Package 256-FBGA 256-ball FBGA (FineLine BGA)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40 °C to +85 °C (Industrial) 0C to +85C (commercial)
Architecture OptiFLEX (LUT-based) —
Configuration SRAM (volatile, requires config device) —
I/O Compatibility MultiVolt (3.3V / 5.0V) —
RoHS Status Not RoHS compliant (SnPb) unknown
Logic Elements / Cells — 1960
Total Gates — 24K
Maximum Internal Frequency — 172 MHz
Maximum Operating Frequency — 142.86 MHz
Supply Voltage — 3.3 V
Pins / Balls — 256
Device Type — FPGA (Field Programmable Gate Array) / SPLD classification in some catalogs
Configuration Method — SRAM, serial/parallel via MAX+PLUS II or Quartus
Speed Grade — -3 (fastest of three FLEX 6000 commercial grades)
Lead-Free — unknown
Supplier Package Code — BGA-256 / FBGA-256

Datasheets & Resources

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