EPF6024ATC144-11 vs EPF6024ATC144-18 Comparison

Detailed side-by-side comparison of EPF6024ATC144-11 by Intel and EPF6024ATC144-18 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024ATC144-11 EPF6024ATC144-18
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Device Logic Elements 1,960 —
Typical Gates 24,000 —
Logic Array Blocks (LABs) 196 196
User I/O Pins 117 117
Speed Grade -11 -18
Package 144-LQFP (LQFP-144, 20x20 mm, 0.5 mm pitch) 144-pin TQFP (TQFP144)
Configuration Technology SRAM (volatile, requires external configuration device) SRAM-based, volatile
Core Voltage 5 V —
Process Technology 0.42 µm CMOS CMOS, 5V-tolerant I/O
Logic Element Structure 4-input LUT with dedicated carry and cascade chains —
Programming Interface JTAG (ByteBlaster / BitBlaster compatible) —
Mounting Type Surface Mount Surface Mount
Operating Temperature (Commercial) [DATA_NEEDED: full commercial/industrial temp range] —
RoHS Status [DATA_NEEDED: lead-free / RoHS compliance status] [DATA_NEEDED: RoHS status]
Recommended Configuration Device EPC1, EPC1441 (or compatible serial configuration PROM) —
Device Logic Elements (LEs) — 1,960
Typical Gate Count — 24,000
Core Supply Voltage — 3.3 V
I/O Supply Voltage — 3.3 V (5V tolerant input)
Operating Temperature — 0 C to +85 C (industrial)
Configuration Interface — JTAG / Serial / Parallel (FLEX scheme)
LE Architecture — 4-input LUT with carry and cascade chains

Datasheets & Resources

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