EPF6024ATC144-11 vs EPF6024ATC144-1N Comparison

Detailed side-by-side comparison of EPF6024ATC144-11 by Intel and EPF6024ATC144-1N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6024ATC144-11 EPF6024ATC144-1N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Family FLEX 6000 —
Device Logic Elements 1,960 —
Typical Gates 24,000 —
Logic Array Blocks (LABs) 196 —
User I/O Pins 117 —
Speed Grade -11 -1 (fastest for TQFP-144)
Package 144-LQFP (LQFP-144, 20x20 mm, 0.5 mm pitch) —
Configuration Technology SRAM (volatile, requires external configuration device) —
Core Voltage 5 V —
Process Technology 0.42 µm CMOS 0.42 µm CMOS, SRAM-based
Logic Element Structure 4-input LUT with dedicated carry and cascade chains —
Programming Interface JTAG (ByteBlaster / BitBlaster compatible) —
Mounting Type Surface Mount Surface Mount
Operating Temperature (Commercial) [DATA_NEEDED: full commercial/industrial temp range] —
RoHS Status [DATA_NEEDED: lead-free / RoHS compliance status] [DATA_NEEDED: RoHS status]
Recommended Configuration Device EPC1, EPC1441 (or compatible serial configuration PROM) —
Series — FLEX 6000
Family Name — FLEX 6000
Logic Elements / Cells — 1,960
Number of LABs/CLBs — 196
Number of Logic Elements — 1,960
Number of I/O — 117
Total RAM Bits — [DATA_NEEDED: total RAM bits]
Number of Gates — 24,000 (typical)
Voltage - Supply — 3.0 V to 3.6 V
Operating Temperature — 0°C to +85°C (commercial, -1N grade)
Package / Case — 144-LQFP / 144-TQFP (20 x 20 mm, 1.0 mm pitch)
Configuration Memory — SRAM (volatile, requires EPC device or download cable)
JTAG / Boundary Scan — Yes (IEEE 1149.1)

Datasheets & Resources

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